Nanotechnology -Physical Vapor Deposition
Physical Vapor Deposition (PVD)
PVD covers a number of deposition technologies in which material is released from a source and transferred to the substrate. The two most important technologies are evaporation and sputtering.
When to use PVD?
PVD comprises the standard technologies for deposition of metals. It is far more common than CVD for metals since it can be performed at lower process risk and cheaper in regards to materials cost. The quality of the films are inferior to CVD, which for metals means higher resistivity and for insulators more defects and traps. The step coverage is also not as good as CVD. The choice of deposition method (i.e. evaporation vs. sputtering) may in many cases be arbitrary, and may depend more on what technology is available for the specific material at the time.
PVD covers a number of deposition technologies in which material is released from a source and transferred to the substrate. The two most important technologies are evaporation and sputtering.
When to use PVD?
PVD comprises the standard technologies for deposition of metals. It is far more common than CVD for metals since it can be performed at lower process risk and cheaper in regards to materials cost. The quality of the films are inferior to CVD, which for metals means higher resistivity and for insulators more defects and traps. The step coverage is also not as good as CVD. The choice of deposition method (i.e. evaporation vs. sputtering) may in many cases be arbitrary, and may depend more on what technology is available for the specific material at the time.
