Nanotechnology - Electrodeposition
Electrodeposition
This process is also known as "electroplating" and is typically restricted to electrically conductive materials. There are basically two technologies for plating: Electroplating and Electroless plating. In the electroplating process the substrate is placed in a liquid solution (electrolyte). When an electrical potential is applied between a conducting area on the substrate and a counter electrode (usually platinum) in the liquid, a chemical redox process takes place resulting in the formation of a layer of material on the substrate and usually some gas generation at the counter electrode.
In the electroless plating process a more complex chemical solution is used, in which deposition happens spontaneously on any surface which forms a sufficiently high electrochemical potential with the solution. This process is desirable since it does not require any external electrical potential and contact to the substrate during processing. Unfortunately, it is also more difficult to control with regards to film thickness and uniformity. A schematic diagram of a typical setup for electroplating is shown in the figure below.
This process is also known as "electroplating" and is typically restricted to electrically conductive materials. There are basically two technologies for plating: Electroplating and Electroless plating. In the electroplating process the substrate is placed in a liquid solution (electrolyte). When an electrical potential is applied between a conducting area on the substrate and a counter electrode (usually platinum) in the liquid, a chemical redox process takes place resulting in the formation of a layer of material on the substrate and usually some gas generation at the counter electrode.
In the electroless plating process a more complex chemical solution is used, in which deposition happens spontaneously on any surface which forms a sufficiently high electrochemical potential with the solution. This process is desirable since it does not require any external electrical potential and contact to the substrate during processing. Unfortunately, it is also more difficult to control with regards to film thickness and uniformity. A schematic diagram of a typical setup for electroplating is shown in the figure below.
Typical setup for electrodeposition
When to use electrodeposition?
The electrodeposition process is well suited to make films of metals such as copper, gold and nickel. The films can be made in any thickness from ~1µm to >100µm. The deposition is best controlled when used with an external electrical potential, however, it requires electrical contact to the substrate when immersed in the liquid bath. In any process, the surface of the substrate must have an electrically conducting coating before the deposition can be done.
The electrodeposition process is well suited to make films of metals such as copper, gold and nickel. The films can be made in any thickness from ~1µm to >100µm. The deposition is best controlled when used with an external electrical potential, however, it requires electrical contact to the substrate when immersed in the liquid bath. In any process, the surface of the substrate must have an electrically conducting coating before the deposition can be done.
